Excellent pcb assembly service provider

High quality pcb assembly provider? What we provide is not only PCB & MCPCB manufacturing, but also including PCB duplicating, Engineering & process design, components management & sourcing solution, PCB in house assembly & full system integration, surface mounted technology (SMT), full products assembly & testing. Read additional info on ultra thin core pcb. PCB is an acronym for printed circuit board. It is a board that has lines and pads that connect various points together. In the picture above, there are traces that electrically connect the various connectors and components to each other. A PCB allows signals and power to be routed between physical devices. Solder is the metal that makes the electrical connections between the surface of the PCB and the electronic components. Being metal, solder also serves as a strong mechanical adhesive.

Best Through Hole Technology assemble more than 50 kinds components Factory Price. We offer a complete range of through hole PCB assembly capabilities in compliance with IPC quality standards. We provide Through Hole Technology (THT) PCBA service at the highest quality level and in a cost-effective manner. Our through hole technology (THT) PCB Assembly services includes both manual and automated techniques. While our manual soldering techniques can handle complex assemblies, the automated ones are best suited for high volume production as well as reduced material handling. We provide THT PCBA service at the highest quality level and in a cost-effective manner. Equipment: We purchased many advanced, art-of-state machines & devices for PCB manufacturing, checking, to improve the quality of our boards.

In order to provide one-stop-services to customers, we can also provide FPC and Rigid-flex PCB Assembly service (also named SMT: Surface Mounting Technology). We can purchase all components from abroad or domestic market, and provide full products to you with short lead time. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.

While Flexible PCBs offer significant advantages, they are also prone to damages. Broadly damages can accrue from two factors: environmental factors and problems that account for issues at the design/fabrication stages. Let us look at both these aspects in some detail. Several environmental factors can cause damage to PCBs, including moisture, static electricity, dust, extreme temperatures, chemical corrosion, and pests. For example, if the PCB is stored in an environment with a lot of moisture, it can destroy the flexible PCB. Moisture can result in a short. Also, given that molds can grow in a damp environment, it will result in a circuit failure. The storage area must be free of any static creating agents. Storing PCBs in carpeted rooms, for example, can result in damage to printed circuit boards on account of the static electricity generated.

According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Read additional information on https://www.bstpcb.com/.

The main difference between a FR4 board and MCPCB is the thermal conductivity dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and metal backing plate. Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink. According to lab testing a MCPCB with a 1W LED remained near an ambient of 25C, while the same 1W LED on a FR4 board reached 12C over ambient. LED PCB always be produced with Aluminum core, but sometimes steel core PCB also be used.

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