Electronic parts information details information aggregation platform 2022

Electronic parts information details info details 2022? Easybom is proud to provide a communication bridge to suppliers, purchasers, and engineers. That makes it easier for them to communicate and find each other more easily. “Win-win and mutual-win” is the philosophy that easybom insists on. easybom has the most suppliers, purchasers, and engineers in the world. easybom introduced the latest electronic components to the market. In easybom, you can find anything you want. The goal of easybom is to create a large number of business opportunities for each user in the world by using data analysis in the most convenient way. Easybom provides intelligent data analysis to enhance your insight into the market. It focuses on the market as well as your need. Easybom establishes a communication bridge for suppliers, purchasers and engineers with electronic component data as its core. Find more details on electronic parts.

Orthogonal frequency division multiple access OFDMA: Friends who are familiar with Wi-Fi should know that the empty port of Wi-Fi adopts orthogonal frequency division multiplexing (OFDM) modulation, that is, the whole bandwidth is composed of orthogonal subcarriers. In Wi-Fi 6, the 802.11 working group introduced OFDMA access from LTE. The addition of such an “A” word can be said to have brought a qualitative change to the network capacity. As shown in the figure on the left below, Wi-Fi 5-based OFDM can only allocate all the bandwidth in the channel to one user at any one time, even if that user’s data needs do not need to take up all the bandwidth. When other users connect to the network, they need to wait for the next sending opportunity window (TXOP). This is very inefficient in the use of channel resources, especially when there is a significant increase in equipment.

Then, as demand for cars picks up in the fall of 2020, Toyota Denso Renesa plans to order 28nm semiconductors from TSMC again, but there is no room to produce in-car semiconductors because TSMC lines are occupied by other semiconductors. Although the inventory in the autumn and winter of 2020 exceeded the limit, by 2021, inventory had bottomed out, coupled with the shortage of 28nm semiconductors, cars could not be made. 28nm is the last generation of planar transistors (FinFET from 16 / 14nm to 3D) (2) do not use self-aligned double pattern (SADP) (will use SADP from FinFET) (3) Renesas vertical integration (integrated equipment manufacturer IDM), for example, outsource production to FinFET from this generation. In short, 28nm semiconductors produced by TSMC and other contract factories have a good performance-to-price ratio, so many electronic devices, including automobiles, use this semiconductor. At the invitation of the Japanese government, the TSMC Kumamoto plant, which will begin operation in 2024, will also mainly produce such 28nm semiconductors.

The basic content of SoC definition is mainly in two aspects: one is its composition, and the other is its formation process. The composition of the system-level chip can be a system-level chip control logic module, a microprocessor/microcontroller CPU core module, a digital signal processor DSP module, an embedded memory module, and an interface module for external communication, and an ADC/DAC module. Analog front-end modules, power supply, and power management modules, for a wireless SoC there are also RF front-end modules, user-defined logic (which can be implemented by FPGA or ASIC), and micro-electromechanical modules, and more importantly, an SoC chip with embedded Basic software (RDOS or COS and other application software) modules or loadable user software, etc. The system-on-chip formation or generation process includes the following three aspects.

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